WEICON Main Catalogue Chemical and technical products Page 52
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Adhesives / Sealants Technical Data WEICON Epoxy Adhesives in liquid condition improved formula Technical Sprays improved formula Easy-Mix HT 250 Epoxy Minute Adhesive Aluminium Fast Metal Minute Adhesive Minute Adhesive epoxy resin epoxy resin unfilled viscous viscous epoxy resin aluminium-filled pasty, gap-filling Easy-Mix S 50 yellow Easy-Mix N 50 Easy-Mix N 5000 Easy-Mix Metal Easy-Mix HT 180 epoxy resin unfilled epoxy resin unfilled epoxy resin unfilled epoxy resin unfilled Consistency: viscous viscous viscous fluid Supplied in: double cartridge double cartridge double cartridge double cartridge epoxy resin high-filled pasty, gap-filling double cartridge epoxy resin mineral-filled pasty, gap-filling double cartridge Content: 50 ml 50 ml 50 ml 50 ml 50 ml 50 ml 50 ml 24 ml 24 ml 24 ml Mixing proportion by volume resin / hardener (automatically): 1:1 1:1 1:1 1:1 1:1 2:1 2:1 1:1 1:1 1:1 Pot life with 10 ml material at +20°C (+68°F) 4-5 4-5 45 20 4-5 60 150 4-5 4-5 4-5 double syringe double syringe double syringe 1.20 1.20 1.07 1.07 1.46 1.10 2.10 1.20 1.23 1.46 8,500 mPa.s (cP) 7,500 mPa.s (cP) 5,000 mPa.s (cP) 55,000 mPa.s (cP) pasty 38,000 mPa.s (cP) 8,500 mPa.s (cP) 125,000 mPa.s (cP) 55,000 mPa.s (cP) Processing*1: +10 to +30 °C (+50 to +86 °F) +10 to +30 °C (+50 to +86 °F) +10 to +40 °C (+50 to +104 °F) +10 to +35 °C (+50 to +95 °F) +10 to +30 °C (+50 to +86 °F) +10 to +40 °C (+50 to +104 °F) +10 to +40 °C (+50 to +104 °F) +10 to +30 °C (+50 to +86 °F) +10 to +30 °C (+50 to +86 °F) +10 to +30 °C (+50 to +86 °F) Cure: +6 to +40 °C (+43 to +104 °F) +6 to +40 °C (+43 to +104 °F) +10 to +40 °C (+50 to +104 °F) +6 to +40 °C (+43 to +104 °F) +6 to +40 °C (+43 to +104 °F) +10 to +50 °C (+50 to +122 °F) +10 to +50 °C (+50 to +122 °F) +6 to +40 °C (+43 to +104 °F) +6 to +40 °C (+43 to +104 °F) +6 to +40 °C (+43 to +104 °F) transparent yellow grey black grey transparent aluminium grey 2 mm 2 mm 2 mm 2 mm 4 mm 4 mm 4 mm 2 mm 4 mm 4 mm Handling strength (35%) after: 15 min. 30 min. 120 min. 60 min. 7 min. 120 min. 8h 15 min. 25 min. 7 min. Capable of bearing mechanical loads (50% strength) after: 20 min. 60 min. 24 h 3h 35 min. 4h 14 h 20 min. 2h 35 min. 24 h 24 h 72 h 48 h 24 h 24 h 24 h 24 h 24 h 24 h 58 (8,410) Viscosity of the mixture at +20°C (+68°F): Temperature Colour: Gap covering power to max.*²: Cure time at +20°C (+68°F) double cartridge epoxy resin high-filled pasty, gap-filling 5,000 mPa.s (cP) Density of the mixture (g/cm³): Technical Liquids improved formula Easy-Mix S 50 Base: Assembly Pastes improved formula Final strength (100 %) after: slighty yellow, almost colourless, crystal clear clear Lubricants WEICON Epoxy Adhesives in fully-cured condition Pressure MPa (psi) (DIN EN ISO 604): 9 (1,300) 9 (1,300) 90 (13,000) 10 (1,500) 58 (8,410) 52 (7,540) 60 (8,700) 9 (1,300) 8 (1,200) Tensile MPa (psi) (DIN EN ISO 527-2): 52 (7,540) 40 (5,800) 35 (5,100) 40 (5,800) 32 (4,640) 27 (3,910) 50 (7,200) 52 (7,540) 34 (5,000) 32 (4,640) 2,000 - 2,200 (300 - 400) 2,000 - 2,500 (300 - 400) 2,000 - 2,500 (300 - 400) 1,700 - 2,000 (200 - 300) 4,000 - 4,200 (600 - 700) 2,300 - 2,700 (330 - 390) 4,000 - 5,000 (600 - 730) 2,000 - 2,200 (300 - 400) 4,000 - 4,500 (600 - 700) 4,000 - 4,200 (600 - 700) Torsion MPa (psi) (DIN EN ISO 178): 58 (8,400) 58 (8,400) 50 (7,300) 50 (7,300) 58 (8,400) 46 (6,670) 40 (5,800) 58 (8,400) 58 (8,400) 58 (8,400) Shore hardness D (DIN ISO 7619): Other 83 65 55 65 82 80 90 83 45 82 Steel, sand-blasted N/mm² (psi): 22 (3,190) 20 (2,900) 17 (2,500) 21 (3,000) 22 (3,190) 23 (3,330) 20 (2900) 22 (3,190) 20 (2,900) 22 (3,190) Aluminium, sand-blasted N/mm² (psi): 11 (1,600) 19 (2,800) 16 (2,300) 19 (2,800) 13 (1,900) 13 (1,880) 15 (2180) 11 (1,600) 19 (2,800) 13 (1,900) Rigid PVC, roughened N/mm² (psi): 13 (1,900) 13 (1,900) 11 (1,600) 14 (2,000) 11 (1,600) 11 (1,600) 11 (1,600) 13 (1,900) 11 (1,600) 11 (1,600) -50 to +180 °C (-58 to +356 °F) Linear shrinkage*3: 20 mm/m 20 mm/m 20 mm/m 20 mm/m 3 mm/m 3 mm/m 7 mm/m 20 mm/m 3 mm/m 3 mm/m approx. 1.4% approx. 2.0 % approx. 2.0 % approx. 2.0 % approx. 0.72% approx. 0.3 % approx. 0.7 % approx. 1.4% approx. 0.3 % approx. 0.72% Tg after curing at room temperature Tg after tempering at 80 °C Tg after tempering at 90 °C Tg after tempering at 120 °C 44.7 °C -50 to +80 °C (-58 to +176 °F) --- -50 to +100 °C (-58 to +212 °F) 48.6 °C -50 to +100 °C (-58 to +212 °F) -50 to +180 °C -50 to +200 °C -50 to +120 °C -50 to +180 °C (-58 to +356 °F) (-58 to +392 °F) -50 to +180 °C (-58 to +248 °F) -50 to +180 °C (-58 to +356 °F) briefly to +230 °C briefly to +250 °C (-58 to +356 °F) briefly to +150 °C (-58 to +356 °F) (+446 °F) (+482 °F) (+302 °F) Temperature resistance: Glass transition temperature WEICON TOOLS® Average tensile shear strengtht as per DIN EN 1465 on: E-Modul DIN EN ISO 527-2 MPa (KSI) 52.4 °C 44.3 °C 54.4 °C --- 44.7 °C --- --- --- --- --- --- --- 65 °C --- --- --- 46.1 °C --- --- --- 32.5 °C --- --- 46.1 °C --- 32.5 °C --- --- 49.8 °C 54.2 °C --- 44.7 °C --- --- --- --- *1 For easier workability when ambient temperatures are low, the double cartridges should be warmed up to room temperature (20°C/+68°F) before application. *2 These specifications depend on the type and condition of the bonding materials and are only relevant for adhesive bondings. When casting e.g. electronic components, a layer thickness of 10 mm should not be exceeded. *3 Measured by a 900 mm x 75 mm x 10 mm mould after storage for 7 days at +20°C (+68°F). 52 Catalogue WEICON 44.3 °C
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